Interconnect and Integrated Devices Group Lead

The Interconnect and Integrated Devices Group at HRL Laboratories is a highly talented team of scientists and engineers with diverse backgrounds in integrated circuit design, microfabrication, advanced packaging and integration, materials characterization, and device test. This team is focused on rapidly developing new technologies and transitioning them out of the research lab and into the development pipeline.

We seek a self-motivated scientist / engineer with strong communication and leadership skills to serve as the Group Leader (first line manager) for the Interconnect and Integrated devices team. The role consists of roughly 25% management and 75% technical contributions. Line management duties include managing resources (e.g. allocating team personnel to projects), talent acquisition (e.g. recruiting), performance management through informal and formal feedback, and additional department-wide, lab-wide, and company-wide assignments (e.g. business development and planning for capital investments), as well as providing critical feedback to staff. Technical contributions (through direct technical work and/or technical project leadership) should be aligned with the skills and capabilities of the team. The position will also involve collaboration with senior management to develop lab-wide strategy in these areas. Technical and managerial duties require the candidate to present details of work to colleagues and customers, create and manage work plans to meet or exceed schedule deadlines, and provide written and oral summaries of work performed as needed (e.g. for reports).

At least 2 years of experience in a role involving leadership of highly trained technical staff. Demonstrated experience with successful resource allocation and management of technical projects.

More than 7 years of experience in one or more of: material properties of insulators when operating at cryogenic temperatures; material properties of metals when operating at cryogenic temperatures; photonic, RF, integrated circuit design.

Must have authored scientific publications and given technical presentations.

Experience with proposal writing and program management is desired.

In-depth knowledge of advanced materials, device design, and fabrication is desired.

In-depth knowledge of active passive photonic or RF component integration through various platform is desired.

Strong desire to learn new technologies and flexibility to change from one project to another quickly.

Strong technical writing, proposal, presentation, and general communication skills are desired.

Proficiency in use of computers, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment.

Ability to work well in a team and independently.

Ph.D. in Electrical Engineering, Physics, Materials Science, or related scientific discipline

Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.

Must be able to occasionally work in a cleanroom environment.

U.S. citizenship is required.

The base salary range for this full-time position is $163,150 - $209,088 + bonus + benefits.

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.

We are proud to be an EEO/AA employer M/F/D/V. We maintain a drug-free workplace and perform pre-employment substance abuse testing.